Position statement ：

1、As the quality docking window for clients, it receives customer requirements and communicates them internally;

2、Evaluate the quality clauses involved in the customer quality agreement and contract, and propose the risk points;

3、Provide the materials requested by the customer, communicate the materials requested by the customer to Fab factory and packaging and testing factory, and follow up and reply to the customer or sales staff in time;

4、Assisted in the audit of end customers and the preparation of improvement reports submitted by customers;

5、Analyze and confirm quality anomalies, implement improvement measures, and track their progress.

6、When third-party FA analysis is required, follow up the analysis from the third-party testing agency.

7、Responsible for drafting and organizing internal reviews of 8D reports, and submitting approved reports to clients or sales teams.

8、Assisted to improve customer related internal management process, and followed up the improvement;

9、Other tasks assigned by superiors.

Job Requirements:  

1、Have the quality background of upstream and downstream of semiconductor industry chain, familiar with chip processing and manufacturing process and quality management process;

2、Familiar with the product characteristics, usage characteristics and test methods and indicators of the company's products;

3、Familiar with computer operation;

4、Good communication and coordination ability, team spirit, strong practical ability;

5、Good process analysis and improvement ability, careful work;

6、Strong sense of responsibility and strong ability to work under pressure.

Email to：huan.liang@canaantek.com

Collaborate with project and planning departments to systematically implement the mass production of engineering materials and products in the factory, ensuring efficient and rapid deployment. Monitor the stable and efficient transition of engineering products into mass production during packaging development, while developing new technologies and materials. Support cost reduction initiatives and assist in new factory site evaluations.

1. Responsible for developing and validating the backend of new products (including packaging, substrates, bumping, and FA analysis/verification as well as reliability).

2. Based on project priority and process risk TRA1 level, discuss design solutions with packaging plant, and develop specific product packaging development plan and effective improvement evaluation measures in advance;

3. Responsible for developing and maintaining product specifications, product design, and related manuals.

4. Responsible for addressing packaging-related issues, coordinating with packaging plants to monitor product development plans and improvement measures, and managing packaging resources to ensure rapid and stable progress of engineering products. Conducts comprehensive reviews of DOE (Design of Experiments) results or post-evaluation TRA2 (Technical Review and Approval) outcomes to minimize risks and maintain controllable measures. Regularly updates packaging plants on product development status through weekly meetings, evaluates the rationality of anomaly handling procedures, and ensures project timelines align with target milestones.

5. Support the analysis and localization of production anomalies. For legacy issues from the engineering development phase and new problems arising during mass production, collaborate with the Quality Department's Supplier Management Team to propose packaging solutions and implement corrective actions. Clearly identify risks and minimize losses. For customer complaints regarding packaging-related issues, work with the Quality Department to investigate and provide engineering assessments and recommendations.

6. Document standardization: Standardize the packaging of input and output materials for each stage of new product development A0.3-A1.0, and review and determine whether to accept them one by one during process monitoring.

7. Reduce cost and improve efficiency, define whether the new product is a new process, define the effective verification and audit standards of the new process in advance, and develop a closed loop of follow-up acceptance;

8. Technical development, regular contact with the factory engineering department and development department, try to carry out cooperation evaluation in advance;

9. Develop standardized management protocols for the maintenance engineering department to efficiently handle NPI projects and tasks assigned by superiors.

Job Requirements:  

1. Bachelor's degree or above, major in microelectronics/electronic information/automation.

2. Familiar with semiconductor packaging and testing production process, familiar with radio frequency chip module related products, mass production experience is preferred.

3. Understand the basic principles of semiconductor process and device, basic circuit and electronic components.

4. Familiar with wafer-level packaging and carrier board process flow, experience in packaging modules is preferred.

5. Clear thinking, modest and progressive, and able to be task-oriented and goal-oriented.

6. English at level 4 or above, basic reading and writing skills.

7. Strong interpersonal communication and cross-department coordination skills, proficient in office software and document writing.

8. At least 3-5 years of experience in traditional packaging related positions.

Email to：huan.liang@canaantek.com

Position Description:

1. Test Planning & Execution: Participate in the formulation of laboratory test plans and schemes for chip testing. Oversee the use, maintenance, and calibration of test equipment, including the construction and verification of test platforms, ensuring thorough product testing is completed.

2. EVB Design Evaluation:Lead the evaluation of Evaluation Board (EVB) designs, with a strong understanding of de-embedding methods and their respective advantages and limitations.

3. Data Analysis & Problem-Solving:Analyze test data and work closely with design engineers and ATE engineers to identify issues and optimize designs.

4. Customer Collaboration:Engage with customer technical teams to understand product requirements, communicate effectively, and participate in the development of tailored product and technical solutions.

Job Requirements:

1. Educational Background & Experience:A Bachelor's degree or higher in Electrical & Electronics Engineering or a related field with at least 5 years of hands-on experience in RF testing and engineering.

2. RF & Circuit Knowledge:Deep understanding of radio frequency, microwave theory, and circuit design. Familiarity with mobile phone RF architecture and link budgets, along with an understanding of the relationship between key RF metrics.

3. Debugging & Testing Proficiency:Extensive experience in both small- and large-signal testing, with a strong grasp of common RF test metrics and procedures， rich experience in FA.

4. Expertise in RF Test Instruments:Proficient in the use of RF testing tools and test bench for small and large signal test.

5. Teamwork & Communication Skills:A proactive, responsible attitude with strong teamwork and communication abilities.

Preferred Qualifications:

1. RFFE Chip Testing Experience:Previous experience with Radio Frequency Front-End (RFFE) chip testing is highly preferred.

2. Familiarity with Qualcomm, MTK and UNISOC platform

3. Solid RF  knowledge: In-depth knowledge of RF device and system relation.

Email to：huan.liang@canaantek.com